8position single-row unshrouded male header connector.The primary electrical function of this component is to serve as a low-profile board-to-board mezzanine stacking link or a wire-to-board signal routing interface soldered directly into a printed circuit board (PCB).The structural backbone belongs to the universally adopted AMPMODU Interconnect family, specifically featuring a standard 2.54 mm (0.100 inch) pin pitch spacing.The physical housing is molded from a high-temperature, flame-retardant glass-filled thermoplastic capable of safely withstanding the extreme thermal curves of wave or reflow soldering.The 8 square post contacts are manufactured from a high-conductivity copper alloy or phosphor bronze, featuring a high-reliability selective gold plating on the primary mating end, transitioning down to tin plating over the solder tails.The pins are arranged in a strict vertical orientation, utilizing straight through-hole PCB pins to establish a secure, vibration-resistant connection point on the board.Industry Equivalents (Cross-References)The TE Connectivity 87224-8 is the active direct factory replacement code designation, representing the identical component layout manufactured under current global catalog guidelines.The Molex 0022284083 serves as a direct third-party industry alternative, providing an identical 8-position, 0.100-inch pitch unshrouded vertical header that drops into the same PCB pin footprint.The Samtec TSW-108-07-G-S functions as a high-reliability precision alternative, mirroring the single-row through-hole geometry and gold-plated contact interfaces.The FCI / Amphenol 68000-408HLF is a secondary commercial-grade drop-in substitute choice, aligning perfectly with the physical row thickness and grid boundaries of the original AMP link.History of the ComponentThe lineage of this component belongs to AMP Incorporated (Aircraft Marine Products), the global interconnect titan founded in 1941 that engineered the foundational "AMPMODU" modular interconnect platform. AMP developed the 0.100-inch grid standard during the mid-to-late 20th century to streamline the highly dense, multi-board architectures emerging in early computer mainframes and telecommunication racks.Rather than forcing electronics manufacturers to purchase unique, custom-molded pin blocks for every specific low-pin-count trace layout, AMP engineered these unshrouded break-away header rows. A factory worker or automated pick-and-place assembly machine could snap down long master strips into small, specialized segments like this 8-position node, vastly reducing manufacturing bills of materials (BOMs).Following massive corporate realignments in 1999, AMP was acquired by Tyco International, which later evolved into Tyco Electronics and was subsequently rebranded as TE Connectivity. Because the 2.54mm pitch spacing remains the single most common prototyping and device interconnection platform worldwide, TE Connectivity maintains this base product series as an active, globally produced standard.Actual Product Applications (Makes and Models)The Apple IIe Home Computer integrated these 8-position AMP header blocks across its motherboard and early peripheral expansion cards to act as physical configuration pin rows for internal hardware toggles and joystick port routing.The Fluke 8840A Bench Digital Multimeter utilized these small 8-pin headers on its internal logic boards to anchor internal calibration override blocks and factory test-point troubleshooting loops.The Allen-Bradley SLC 500 PLC Power Supply Modules regularly employed these unshrouded through-hole pins inside their chassis blocks to link internal multi-layer PCB boards together in stable stack configurations.
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