Chip Quik Lead-Free No-Clean T3 Solder Paste (10cc)

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Specifications Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 87% metal by weight. Particle Size: T3 (25-45 microns) Melting Point : 217-220C (423-428F) Size: 10cc/35g syringe Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil CleaningAutomated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).Storage and HandlingRefrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Documents Datasheet MSDS Sheet Show more